Ball Grid Array Equipment and Services All types of Ball Grid Array (BGA) components, including PBGA, CBGA, TBGA, EBGA, microBGA. BGA re-ball and repair consists of replacing a component’s faulty solder ball array with a new array of solder spheres. BGA repair and re-ball services include: Replacement of existing BGA with new BGA on PCB assemblies. Remove and re-ball. Precise placing of BGA on proto-type assemblies and/or high volume production runs.