BGA Rework with pre-heater/board holder

The SS 620 BGA Rework system operates similarly but with a digitally controlled and programmble pre-heater adjacent to the board holder.Easyly interchangeble nozzles are used to direct heated gas exclusively toward component solder joints. Nozzles are availble in both Quartz and Aluminum materials with removable baffles. Incorporation of a baffle with each nozzle effectively lowers the rework temperature of the internal components. Finally, a vacuum shroud has been incorporated above the nozzle to pull exiting process gases up and away from the work area. This minimizes heat transfer to adjacent components. Nozzles are available in all sizes and configurations to handle a broad range of components.

The versatile and reliable SS 620 proves that a rework station can be easy to operate without sacrificing process control.